PENSC-A boron nitride ceramic

Grade                PENSC-A PENSC-AA BN% Chemical structure % 99 99.5  Other components   no no Density g/cm3 1.9-2.0 1.55-1.65 Hardness HL 300 300 Flexural Strength Mpa 35 33 （25℃-1200℃） Coefficient of thermal expansion （10-6/K) -1~2.5 -1~2 Thermal conductivity at 20℃ W/mk 40 60 MAX-Temperature of use oxidizing 900℃ 900℃ vacuum 1800℃ 1800℃ ガスinert 2200℃ 2200℃   RT Resistivity Ω.cm ＞1014 ＞1014

FEATURES & ADVANTAGES

● Adopting international advanced hot-pressing sintering process, not use any binder, High purity, good stability.

● High density, Low thermal expansion, High thermal conductivity, especially suitable for semiconductor and microelectronics equipment parts.

● Excellent machining performance can be machined to 0.02mm tolerances. It is the optimal choice of precision ceramic parts.

TYPICAL APPLICATIONS

● Boron nitride parts for Ion Implanters

● Boron nitride insulation spacer and sealing element for high-temperature equipment

● Boron nitride parts for vacuum metalized machines

● Boron nitride nozzles for powder metal atomization