PENSC-A boron nitride ceramic

Grade PENSC-A Chemical structure % 99 Other components   no Density g/cm3 ＞2 Hardness HL 300 Flexural Strength Mpa 35 Coefficient of thermal expansion （10-6/K) -1~2.5 Thermal conductivity at 20℃ W/mk 50 MAX-Temperature of use Oxidizing 900℃ Vacuum 1800℃ Inert 2200℃ RT Resistivity Ω.cm ＞1014

FEATURES & ADVANTAGES

● Adopting international advanced hot-pressing sintering process, not use any binder, High purity, good stability.

● High density, Low thermal expansion, High thermal conductivity, especially suitable for semiconductor and microelectronics equipment parts.

● Excellent machining performance can be machined to 0.02mm tolerances. It is the optimal choice of precision ceramic parts.

TYPICAL APPLICATIONS

● Boron nitride parts for Ion Implanters

● Boron nitride insulation spacer and sealing element for high-temperature equipment

● Boron nitride parts for vacuum metalized machines

● Boron nitride nozzles for powder metal atomization